Electronics For Imaging Campus
IMEG’s San Francisco structural team provided engineering design and services for Electronics For Imaging’s new campus, which consists of a 350,000-sf, five-story structure and a 0180,000-sf, six-story building. A six-story, 300,000-sf parking structure is also included in the campus and provides parking for 1,190 cars. The structural system used on the project is a one-way, cast-in-place, post-tensioned concrete slab supported on precast, pre-stressed concrete beams with concrete columns. Lateral loads are resisted by cast-in-place concrete shear walls. The building is supported by precast concrete pile foundations.